Learn How to Use a Mach Blades in Cell Phone Motherboard - Mobilesentrix

⁣The best blade combination for micro soldering professionals!

• Ma1.0 - Underfill Removal Blade
This blade helps you removing underfill from the logic board around IC Chips to help the microsoldering process.
USA Warehouse: https://www.mobilesentrix.com/blades-ma-1-0

• Ma2.0 - IC Edge Glue Removal Blade

This blade helps you cleaning around IC chips to allow heat to flow properly and to make the chip removal easier.
USA Warehouse: https://www.mobilesentrix.com/blades-ma-2-0

• Ma3.0 - Logic Board and IC Chip Cleaning Blade

This blade allows you to clean the pads on the chip and on the logic board after removing the chip. Either you are replacing the chip completely, or you need the chip cleaned before re-balling it, this is the perfect blade for that!
USA Warehouse: https://www.mobilesentrix.com/blades-ma-3-0

Mobilesentrix offers best quality Cell Phone Motherboard Soldering Parts, Repair Parts at wholesale price.